Toyota Tsusho patented a device for manufacturing SiC substrates, aiming to reduce or remove work-affected layers. The method involves etching SiC substrates inside a main container with a temperature gradient, under vapor pressure of gaseous species containing Si element. GlobalData’s report on Toyota Tsusho gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Toyota Tsusho, Finite element simulation was a key innovation area identified from patents. Toyota Tsusho's grant share as of March 2024 was 30%. Grant share is based on the ratio of number of grants to total number of patents.

Method for manufacturing sic substrate using etching process

Source: United States Patent and Trademark Office (USPTO). Credit: Toyota Tsusho Corp

The granted patent (Publication Number: US11972949B2) discloses a method for manufacturing a SiC substrate involving an etching process conducted within a SiC main container. The process includes heating the container to create a temperature gradient under the vapor pressure of gaseous species containing Si element. Additionally, the method incorporates a Si atom sublimation process to thermally sublimate Si atoms from the surface of the SiC substrate, contributing to the manufacturing process.

Furthermore, the patent details a method for reducing the work-affected layer of a SiC substrate through an etching process within a SiC main container. This process involves heating the etching space inside the container, positioning the SiC substrate on the high-temperature side of the temperature gradient. The etching is performed by arranging the substrate in a space where air is exhausted under the vapor pressure of a gaseous species containing Si element. The method aims to enhance the manufacturing of SiC substrates by optimizing the etching process and reducing the work-affected layer, ultimately improving the quality and efficiency of SiC substrate production.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.