Mitsui Mining & Smelting has patented a composition for a conductive film, including flat metal particles with metal oxide layers and resin. The method involves applying the composition to a base material, sintering with light to form a conductive film. The composition also includes small-diameter copper particles. GlobalData’s report on Mitsui Mining & Smelting gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Mitsui Mining & Smelting, Hydrogen storage alloys was a key innovation area identified from patents. Mitsui Mining & Smelting's grant share as of May 2024 was 44%. Grant share is based on the ratio of number of grants to total number of patents.
Composition for conductive film with flat metal particles and resin
A recently granted patent (Publication Number: US12012523B2) discloses a composition for forming a conductive film, consisting of flat copper particles with a metal oxide layer on their surface. The ratio of the metal oxide layer thickness to the flat particle thickness ranges from 0.010 to 0.300, with the metal oxide layer thickness varying from 0.010 µm to 2.000 µm. Additionally, the composition includes smaller diameter copper particles along with the flat particles.
Furthermore, the patent claims specify the particle diameter, thickness, and shape of both the flat and small-diameter copper particles, emphasizing the importance of their characteristics in forming an effective conductive film. The small-diameter copper particles are required to be spherical and without a metal oxide layer on their surface. The composition's components and their specific properties outlined in the patent aim to enhance the conductivity and performance of the resulting film, catering to various applications where such properties are crucial.
To know more about GlobalData’s detailed insights on Mitsui Mining & Smelting, buy the report here.
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