Dowa has been granted a patent for a mask for partial plating, which allows selective electroplating on a specific area of an insulated circuit board. The mask includes an insulated sheet with an opening corresponding to the desired area, and conductive sheet members attached to a partial region on one surface. The method involves using the mask to selectively electroplate the prescribed portion on the circuit metal member. GlobalData’s report on Dowa gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Dowa, 3D memory devices was a key innovation area identified from patents. Dowa's grant share as of September 2023 was 33%. Grant share is based on the ratio of number of grants to total number of patents.
Partial plating mask for insulated circuit board
A recently granted patent (Publication Number: US11761108B2) describes a method for producing an insulated circuit board with a plated layer. The method involves using a mask for partial plating, which consists of an insulated sheet member with an opening corresponding to the prescribed portion to be plated. The mask also includes a partial region coated with one or more conductive sheet members.
To produce the plated layer, the opening in the mask is aligned with the prescribed portion on the surface of the circuit metal member. The prescribed portion is then brought into contact with a plating solution. The conductive sheet members exposed on the surface of the mask are brought into contact with a portion that should not be plated on the circuit metal member. Electricity is supplied to the circuit metal member via the conductive sheet members and an electrode connected to an external power source, enabling electroplating to occur.
The patent also mentions that the intermediate product of the insulated circuit board can include a ceramic board as the insulated board, with a heat radiation member provided on the back side opposite to the circuit metal member. In this case, the heat radiation member acts as a conductor with a peripheral wall surrounding the end surfaces of the insulated board. The peripheral wall can be used as the electrode connected to an external power source, and the conductive sheet members are brought into contact with the peripheral wall to supply electricity for forming the plated layer.
The method allows for selective electroplating on the prescribed portion of the circuit metal member, providing a way to create insulated circuit boards with plated layers. The use of a mask for partial plating and conductive sheet members simplifies the process and ensures precise plating. The inclusion of a heat radiation member on the ceramic board enhances the functionality of the insulated circuit board by improving heat dissipation.
Overall, this patented method offers an efficient and effective way to produce insulated circuit boards with plated layers, with potential applications in various industries that require reliable and high-performance electronic components.
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