Nippon Steel has patented an epoxy resin composition with superior low dielectric properties and strong adhesion for printed circuit plates. The patent also covers a phenolic resin represented by a specific formula. GlobalData’s report on Nippon Steel gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Nippon Steel, Vehicle camshaft manufacturing was a key innovation area identified from patents. Nippon Steel's grant share as of January 2024 was 24%. Grant share is based on the ratio of number of grants to total number of patents.
Phenolic resin for epoxy resin composition in printed circuit plates
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A recently granted patent (Publication Number: US11884773B2) discloses a novel phenolic resin represented by a specific chemical formula. The patent also details a method for producing this phenolic resin, involving the reaction of dicyclopentadiene with 2,6-disubstituted phenols in the presence of a Lewis acid at a controlled temperature range. Additionally, the patent covers an epoxy resin obtained by epoxidizing the aforementioned phenolic resin, along with various epoxy resin compositions and their applications in prepregs, laminated plates, printed circuit boards, and cured products.
Furthermore, the patent specifies the use of a Lewis acid catalyst of a boron trifluoride-ether complex in the production of the phenolic resin and epoxy resin compositions. The inclusion of specific ratios and temperature conditions in the method for producing the phenolic resin highlights the precision and control required in the manufacturing process. The patent's comprehensive coverage of epoxy resin compositions and their diverse applications in electronic components underscores the potential for innovation and advancement in the field of materials science and electronics manufacturing.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
