Nippon Light Metal has filed a patent for an electrically conductive adhesive that aims to reduce the rise in electric resistance between electronic components and substrates under high temperature and humidity conditions. The adhesive includes a silver-coated conductive filler, with the silver content ranging from 3.5% to 7.0% by volume. The patent also covers the use of this adhesive in electronic circuits and a method for manufacturing such circuits. GlobalData’s report on Nippon Light Metal gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Nippon Light Metal, UAV battery thermal management was a key innovation area identified from patents. Nippon Light Metal's grant share as of September 2023 was 18%. Grant share is based on the ratio of number of grants to total number of patents.
Electrically conductive adhesive with silver-coated filler
A recently filed patent (Publication Number: US20230319988A1) describes an electrically conductive adhesive that can be used in electronic circuits. The adhesive includes an electrically conductive filler, with the surface of the filler coated in a layer of silver. The adhesive contains a specific volume of the conductive filler and silver, ranging from 29.0% to 63.0% and 3.5% to 7.0% respectively.
The electrically conductive filler in the adhesive has a core that can be made of various materials, including metals that are less conductive than silver and ceramics. Examples of these materials include alumina, silica, copper, and aluminum. The adhesive is in an ink state, which means it can be easily applied to different surfaces.
The patent also mentions the use of this electrically conductive adhesive in electronic circuits. It can be used to join various components, such as semiconductor devices, thermoelectric elements, chip components, LED components, and other electric components, onto a resin substrate. The resin substrate must have an electrically conductive part, which can be made of aluminum or copper.
Furthermore, the patent describes different methods for applying the electrically conductive adhesive onto the resin substrate. These methods include dispensing, screen printing, and gravure printing.
In summary, the patent presents an electrically conductive adhesive with specific properties and composition. It can be used in electronic circuits to join various components onto a resin substrate. The adhesive has a specific volume of conductive filler and silver, and the filler can have a core made of different materials. The adhesive is in an ink state and can be applied using different methods.
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