Mitsui Mining & Smelting patented a method for producing a semiconductor package that minimizes device damage. The process involves using a tacky sheet with a soluble layer, creating laminates, mounting a chip, sealing, immersing in a solution to dissolve the tacky layer, and peeling off the support substrate. GlobalData’s report on Mitsui Mining & Smelting gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Mitsui Mining & Smelting, Hydrogen storage alloys was a key innovation area identified from patents. Mitsui Mining & Smelting's grant share as of January 2024 was 30%. Grant share is based on the ratio of number of grants to total number of patents.
Method for producing semiconductor package with soluble tacky layer
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A recently granted patent (Publication Number: US11876070B2) outlines a method for producing a semiconductor package. The method involves a series of steps, including providing a tacky sheet with a soluble tacky layer, creating laminates with redistribution layers, bonding support substrates, mounting a semiconductor chip, sealing with resin, and immersing in a solution to dissolve the tacky layer. By carefully controlling the immersion process and pressure differences, the semiconductor package is obtained by peeling off the support substrate, leaving the chip sealed and exposed for use.
The patent further details specific variations and components of the method, such as the immersion depth in the solution, fixing the laminate with a back plate, utilizing different types of pumps for pressure differences, and the materials used for sealing members. Additionally, the patent specifies requirements for the back plate, the tacky layer composition, and the pattern of the tacky sheet. By incorporating these detailed steps and variations, the method aims to optimize the production process of semiconductor packages, ensuring efficient and reliable results.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
