Dowa has filed a patent for an Ag-plated material with a unique two-layer plating structure on a conductive metal substrate. The structure includes a porous Ni-plated layer followed by an Ag-plated layer. GlobalData’s report on Dowa gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Dowa, 3D memory devices was a key innovation area identified from patents. Dowa's grant share as of January 2024 was 33%. Grant share is based on the ratio of number of grants to total number of patents.

Silver-plated material with two-layer plating structures

Source: United States Patent and Trademark Office (USPTO). Credit: Dowa Holdings Co Ltd

The patent application (Publication Number: US20240026558A1) describes an innovative Ag-plated material that includes a conductive metal substrate with an Ag-plated layer and a series of two-layer plating structures. These structures consist of a porous Ni-plated layer followed by an Ag-plated layer, all arranged in a specific order. Additionally, the material may feature an underlying Ni-plated layer between the two-layer plating structures and the substrate, with specific thickness ranges outlined for each layer.

Furthermore, the patent application details a method for producing this Ag-plated material, involving the formation of the two-layer plating structure on the substrate and the creation of multiple layers of this structure. The method also includes the option of adding an underlying Ni-plated layer and specifies the thickness ranges for the porous Ni-plated layer and the Ag-plated layer. The application also mentions the potential application of this material in electrical components such as contact or terminal components, highlighting its suitability for such uses.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies