Mitsubishi Materials has been granted a patent for a copper/ceramic bonded body, featuring a copper member and an aluminum oxide ceramic member. The invention includes a magnesium oxide layer and a magnesium solid solution layer, enhancing the bond between the two materials. GlobalData’s report on Mitsubishi Materials gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Mitsubishi Materials, Ceramic membrane fuel cells was a key innovation area identified from patents. Mitsubishi Materials's grant share as of June 2024 was 39%. Grant share is based on the ratio of number of grants to total number of patents.
Copper/ceramic bonded body with magnesium oxide layer
The patent US12037294B2 describes a copper/ceramic bonded body and an insulating circuit substrate, both featuring a copper member or sheet and a ceramic member or substrate made of aluminum oxide. A key aspect of these inventions is the incorporation of a magnesium oxide layer at the interface between the copper and ceramic components. Additionally, a magnesium (Mg) solid solution layer is positioned between the magnesium oxide layer and the copper member, containing Mg in a solid solution state within the copper primary phase. The concentration of Mg in this solid solution layer is specified to be between 0.01 atomic percent (at %) and 3 at %. The claims also stipulate that in regions extending 50 micrometers from the bonding surface towards the copper side, the area ratio of intermetallic compound phases should not exceed 15%.
The production methods for both the copper/ceramic bonded body and the insulating circuit substrate involve several steps. Initially, Mg is disposed between the copper and ceramic components, followed by a laminating step where the two are pressed together with Mg interposed. A bonding step then involves heating the laminated assembly under vacuum while maintaining a specific pressing load, which ranges from 0.049 MPa to 3.4 MPa, and a heating temperature between 500°C and 850°C. The amount of Mg used in the disposing step is also defined, falling between 0.17 mg/cm² and 3.48 mg/cm². These detailed specifications aim to enhance the bonding quality and performance of the resulting copper/ceramic structures.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
